hlmp-r100, hlmp-0301, hlmp-0401, hlmp-0504 2.5 mm x 7.6 mm rectangular led lamps data sheet description the hlmp-r100, -0301, -0401, - 0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. they utilize a tinted, difused epoxy to provide high on-of contrast and a fat high inten sity emitting surface. borderless package design allows creation of uninterrupted light emitting areas. the hlmp-r100 uses a double heterojunction (dh) absorbing substrate (as) aluminum gallium arsenide (algaas) red led chip in a light red epoxy package. this combination produces outstanding light output over a wide range of drive currents. the hlmp-0301 has a high efciency red gaasp on gap led chip in a light red epoxy package. the hlmp-0401 provides a yellow gaasp on gap led chip in a yellow epoxy package. the hlmp-0504 provides a green gap led chip in a green epoxy package. package dimensions features ? rectangular light emitting surface ? flat high sterance emitting surface ? stackable on 2.54 mm (0.100 inch) centers ? ideal as fush mounted panel indicators ? ideal for backlighting legends ? long life: solid state reliability ? choice of 4 bright colors C dh as algaas red C high efciency red C yellow C high performance green ? ic compatible/low current requirements 2.54 (0.100) 2.29 (0.090) 2.54 (0.100) 2.16 (0.085) 8.00 (0.315) 7.37 (0.290) 29.21 (1.15) min. cathode lead bottom view side view 1.27 (0.50) nominal notes: 1. all dimensions are in millimeters (inches). 2. an epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. there is a mximum 1 taper from base to the top of lamp. 2.54 (0.100) nominal 0.46 (0.018) sq. nominal 7.62 (0.300) 7.11 (0.280) 7.62 (0.300) 6.99 (0.275)
2 selection guide color part number luminous intensity iv (mcd) at 20 ma min. typ. dh algaas red hlmp-r100 2.1 C red hlmp-0301 2.1 C HLMP-0301-C00XX 1.3 C yellow hlmp-0401 3.6 C hlmp-0401-b00xx 1.4 C hlmp-0401-d00xx 3.6 C green hlmp-0504 2.6 C hlmp-0504-b00xx 1.6 C hlmp-0504-c00xx 2.6 C part numbering system mechanical options 00: bulk 02: tape & reel, straight leads color bin options 0: full color bin distribution maximum iv bin options 0: open (no maximum limit) others: please refer to the iv bin table minimum iv bin options please refer to the iv bin table color options 1. as algaas red 3. high efciency red 4. yellow 5. green package options r,0: rectangular 2.5 mm x 7.6 mm hlmp - x x xx - x x x xx
3 absolute maximum ratings at t a = 25c parameter hlmp-r100 hlmp-0301 hlmp-0401 hlmp-0504 units peak forward current 300 90 60 90 ma average forward current [1] 20 25 20 25 ma dc current [2] 30 30 20 30 ma power dissipation 87 135 85 135 mw reverse voltage (i r = 100 a) 5 5 5 5 v transient forward current [3] (10 s pulse) 500 500 500 500 ma operating temperature range -20 to +100 -40 to +100 -40 to +100 -20 to +100 c storage temperature range -40 to +100 -40 to +100 -40 to +100 -40 to +100 notes: 1. see figure 5 to establish pulsed operating conditions. 2. for algaas red, red, and green series derate linearly from 50c at 0.5 ma/c. for yellow series derate linearly from 50c at 0.2 ma/c. 3. the transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the led die and wirebond. it is not recommended that the device be operated at peak current beyond the peak forward current listed in the absolute maximum ratings.
4 figure 1. relative intensity vs. wavelength. electrical/optical characteristics at t a = 25c sym. description hlmp-r100 hlmp-0301 hlmp-0401 hlmp-0504 units test conditions min. typ. max. min. typ. max. min. typ. max. min. typ. max. 2 q 1/2 included angle between half luminous intensity points 100 100 100 100 deg. note 1. fig. 6 l p peak wavelength 645 635 583 565 nm measure- ment at peak l d dominant wavelength 637 626 585 569 nm note 2. dl 1/2 spectral line halfwidth 20 40 36 28 nm t s speed of response 30 90 90 500 ns c capacitance 30 16 18 18 pf v f = 0; f = 1 mhz r q j-pin thermal resistance 260 260 260 260 c/w junction to cathode lead v f forward voltage 1.8 2.2 1.9 2.6 2.1 2.6 2.2 3.0 v i f = 20 ma figure 2. v r reverse breakdown voltage 5.0 5.0 5.0 5.0 v i r = 100 a h v luminous efcacy 80 145 500 595 lm/w note 3. notes: 1. q 1/2 is the of-axis angle at which the luminous intensity is half the axial luminous intensity. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device. 3. radiant intensity, i e , in watts/steradian, may be found from the equation i e = i v / h v , where i v is the luminous intensity in candelas and h v is the luminous efcacy in lumens/watt. high efficiency red wavelength ? nm relative intensity 1.0 0.5 0 500 550 600 650 700 750 yellow green t a = 25 c algaas red
5 figure 6. relative luminous intensity vs. angular displacement. figure 2. forward current vs. forward voltage. v f (300 ma) for algaas red = 2.6 volts typical. figure 3. relative luminous intensity vs. forward current. figure 4. relative efciency (luminous intensity per unit current) vs. peak current. h v (300 ma) for algaas red = 0.7. figure 5. maximum tolerable peak current vs. peak duration (i peak max determined from temperature derated i dc max). 10 100 40 70 20 60 80 30 50 90 0 10 20 30 40 50 60 70 80 90 1.0 0.6 0.8 0.2 0.4 i f ? forward current ? ma 1.0 v f ? forward voltage ? v 0 20 40 60 2.0 3.0 90 70 green yellow her algaas red 10 30 50 80 4.0 5.0 relative luminous intensity (normalized at 20 ma) 0 i dc ? dc current per led ? ma 0 30 5 15 2.5 2.0 algaas red 0.5 1.0 1.5 10 20 25 her, yellow, green peak ? relative efficiency 0 i peak ? peak current per led ? ma 0.4 0.6 0.8 1.0 90 20 70 50 40 1.3 1.1 yellow green algaas red 0.5 0.7 0.9 1.2 30 60 80 10 her ratio of maximum tolerable peak current to maximum tolerable dc current 1 t p ? pulse duration ? s her, orange, yellow, and green 1.0 2.0 3.0 10,000 1000 4.0 1.5 100 10 i peak max. i dc max. 100 khz 30 khz 10 khz 3 khz 1 khz 300 hz 100 hz t p ? pulse duration ? s algaas red 3 1 10 10 10000 1000 100 1 3 khz 10 khz 1 khz 300 hz f ? refresh rate ? 100 hz 2 9 8 7 6 5 4 ratio of maximum peak current to temperature derated maximum dc current i peak max. i dc max.
6 intensity bin limits color bin intensity range (mcd) min. max. red c 1.5 2.4 d 2.4 3.8 e 3.8 6.1 f 6.1 9.7 g 9.7 15.5 h 15.5 24.8 i 24.8 39.6 j 39.6 63.4 k 63.4 101.5 l 101.5 162.4 m 162.4 234.6 n 234.6 340.0 o 340.0 540.0 p 540.0 850.0 q 850.0 1200.0 r 1200.0 1700.0 s 1700.0 2400.0 t 2400.0 3400.0 u 3400.0 4900.0 v 4900.0 7100.0 w 7100.0 10200.0 x 10200.0 14800.0 y 14800.0 21400.0 z 21400.0 30900.0 maximum tolerance for each bin limit is 18%. intensity bin limits, continued color bin intensity range (mcd) min. max. yellow b 1.6 2.5 c 2.5 4.0 d 4.0 6.5 e 6.5 10.3 f 10.3 16.6 g 16.6 26.5 h 26.5 42.3 i 42.3 67.7 j 67.7 108.2 k 108.2 173.2 l 173.2 250.0 m 250.0 360.0 n 360.0 510.0 o 510.0 800.0 p 800.0 1250.0 q 1250.0 1800.0 r 1800.0 2900.0 s 2900.0 4700.0 t 4700.0 7200.0 u 7200.0 11700.0 v 11700.0 18000.0 w 18000.0 27000.0 green b 1.8 2.9 c 2.9 4.7 d 4.7 7.6 e 7.6 12.0 f 12.0 19.1 g 19.1 30.7 h 30.7 49.1 i 49.1 78.5 j 78.5 125.7 k 125.7 201.1 l 201.1 289.0 m 289.0 417.0 n 417.0 680.0 o 680.0 1100.0 p 1100.0 1800.0 q 1800.0 2700.0 r 2700.0 4300.0 s 4300.0 6800.0 t 6800.0 10800.0 u 10800.0 16000.0 v 16000.0 25000.0 w 25000.0 40000.0 maximum tolerance for each bin limit is 18%.
7 mechanical option matrix mechanical option code defnition 00 bulk packaging, minimum increment 500 pcs/bag 02 tape & reel, straight leads, minimum increment 1300 pcs/reel note: all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago representative for further clarifcation/information. color categories color category# lambda (nm) min. max. green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 yellow 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 tolerance for each bin limit is 0.5 nm.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2015 avago technologies. all rights reserved. av02-1554en - june 24, 2015 figure 7. recommended wave soldering profle precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering conditions: wave soldering manual solder dipping pre-heat temperature 105c max. C pre-heat time 30 sec max. C peak temperature 250c max. 260c max. dwell time 3 sec max. 5 sec max. ? wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c, before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through hole sizes for led component leads: led component lead size diagonal plated through hole diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.718 mm (0.028 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 0 10 20 30 50 100 150 200 250 30 40 50 time ? seconds temperature ? c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma note: allow for boards to be sufficiently cooled before exerting mechanical force.
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